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Model: MT41J128M16JT-125:K

Brand: MICRON 

Type: original          quantity: 51900

Package: BGA        batch number: 19+ROHS

Price: enquiry          sample: support specification: contact customer service.

Description: DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA

  • MT41J128M16JT-125:K
    Standard packing: 1000
    Category: integrated circuit (IC)
    Family: memory
    Series: -
    Packing: bulk
    Format - memory: RAM
    Memory type: DDR3 SDRAM
    Storage capacity: 2G (128M x 16)
    Speed: 1.25ns
    Interface: parallel
    Voltage power: 1.425 V ~ 1.575 V
    Working temperature: 0 C ~ 95 degree C
    Package / shell: 96-TFBGA
    Vendor device package: 96-FBGA (8x14)

    MICRON is one of the world‘s leading suppliers of magnesium optic semiconductor solutions. Through globalized operations, magnesium manufactures and releases DRAM, NAND flash, CMOS image sensors, other semiconductor components and memory modules to the market for frontier computing, consumer goods, networks and mobile portable products.

    DDR3 SDRAM is the full name of DDR3. It aims at the generation of memory technology of Intel new chip (but now it is mainly used for graphics memory), and its frequency is above 800M. DDR3 is a new design on the basis of DDR2. Compared with DDR2 SDRAM, it has the advantages of less power consumption, less heating amount, higher working frequency, lower overall cost and versatility of the graphics card.
    Advantageous editors
    Less power and heat
    The lesson of DDR2 is drawn, which reduces energy consumption and heat consumption on the basis of controlling cost, making DDR3 easier to be accepted by users and manufacturers.
    Higher working frequency
    Due to lower energy consumption, DDR3 can achieve a higher working frequency, to a certain extent, to make up for the disadvantages of a longer delay, but also as one of the selling points of the graphics card, which has been shown on the graphics card with the DDR3 memory.
    Reducing the overall cost of the graphics card
    The size of DDR2 memory particles is mostly 4M X 32bit, which needs 8 128MB memory devices that are commonly used in high-end graphics cards. The DDR3 memory specification is mostly 8M X 32bit, and the capacity of a single particle is large, and the 4 can constitute 128MB memory. As a result, the PCB area of the graphics card can be reduced and the cost can be effectively controlled. Besides, the power consumption of the video memory can be further reduced after the number of particles is reduced.
    Good generality
    DDR3 has better compatibility with DDR2 than DDR changes to DDR2. Because the key features such as pin and encapsulation are unchanged, DDR3 display can be used with a little modification of the display core of DDR2 and the graphics card of the public version, which is good for the manufacturer to reduce the cost.
    At present, DDR3 has been widely used in most high-end graphics cards.
    New design editor
    The 1.8bit prefetch is designed, while DDR2 is prefetching for 4bit, so that the DRAM core frequency is only 1/8 of the interface frequency, and the core frequency of DDR3-800 is only 100MHz.
    2. point to point topology is used to alleviate the burden of address / command and control bus.
    3. use the production process less than 100nm to reduce the working voltage from 1.8V to 1.5V, and increase the function of asynchronous reset (Reset) and ZQ calibration.
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