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Samsung will invest 10 billion U.S. dollars to build a fab in the United States

Time:2020-11-20 Views:331
On the 18th, officials from Phoenix, Arizona, approved the TSMC development project of US$205 million in funding to assist TSMC in building a US$12 billion wafer fab plan to improve local roads and water resources. This will become the nation‘s first. Block advanced process facilities.
In response, the South Korean industry broke the news that TSMC’s competitor in the foundry field, Samsung Electronics, has recently confirmed that Austin, Texas, has proposed a system LSI plant plan that uses extreme ultraviolet (EUV) lithography technology, with an investment of approximately US$10 billion.
According to a Korean media "infostockdaily" report, according to Samsung and related industry sources, Samsung Electronics will build a fab in Austin, Texas, and use EUV lithography machines to produce non-memory semiconductors and system LSI products. Investment scale is estimated US$10 billion, with a monthly production capacity of about 70,000 pieces.
In order to rush to become the leader in non-memory semiconductors in 2030, South Korea spent a lot of money to buy EUV machines from ASML. Samsung Group Vice President Lee Jay-yong also went to ASML‘s headquarters in the Netherlands a few days ago, hoping to quickly purchase goods from the company , In order to hope to defeat TSMC in advanced manufacturing process.
Korean media have reported that Samsung has also attacked the customized system-on-chip (SoC) team and allowed its system LSI department to establish a "Custom SoC" customized single-chip team to establish close cooperation with major ICT manufacturers around the world.
According to Reuters, according to the TSMC development agreement proposed by Phoenix, the city government will allocate US$205 million to improve infrastructure such as roads and water sources. US$61 million will be used to build roads and US$37 million will be used to replenish water. Resource infrastructure, and $107 million to improve wastewater treatment. TSMC will build new factories and create 1,900 new job opportunities in the next five years.
TSMC’s board of directors recently approved the plan to establish a 100% shareholding subsidiary in Arizona, with a paid-in capital of US$3.5 billion and a paid-in capital of US$3.5 billion (approximately NT$99.75 billion). According to TSMC’s announcement on May 15 to set up a factory in the United States, TSMC will use a 5-nanometer process to produce chips, with a planned monthly production capacity of 20,000 chips, directly creating more than 1,600 high-tech professional job opportunities, and indirectly creating thousands of job opportunities. .
The production of semiconductor chips, with a planned monthly production capacity of 20,000 wafers, will directly create more than 1,600 high-tech professional job opportunities, and indirectly create thousands of job opportunities in the semiconductor industry ecosystem. TSMC currently has a fab in Camas, Washington, and has design centers in Austin, Texas, and San Jose, California. Arizona will become TSMC’s second production base in the United States.
Extended reading: Samsung spends $116 billion to accelerate the development of 3nm
After Samsung Electronics announced last year that it would invest US$116 billion in its foundry business, Samsung senior executives recently revealed that 3nm chips are expected to be mass-produced in 2022, catching up with the progress of foundry leader TSMC (2330-TW) , Grabbing large orders from Apple, Super Micro and other advanced manufacturing processes.
A senior executive of Samsung’s foundry department said at an event last month that Samsung’s 3nm chips will be officially mass-produced in 2022. This news has not been mentioned before, which means that Samsung will be in the same year as TSMC. With the launch of 3 nanometer chips, Park Jae-hong, executive vice president of development of Samsung‘s foundry design platform, said at the event that Samsung has now developed initial R&D tools with partners.
If 3nm process Samsung can catch up with TSMC by then, it will have the opportunity to become an alternative manufacturer for Apple (AAPL-US) and AMD (AMD-US) high-end chips other than TSMC. Park Jae-hong said, in order to actively keep up with the market Samsung will continue to develop and innovate and strengthen Samsung’s foundry ecosystem through close cooperation with partners. This move also implies that Samsung is speeding up the development of systems-on-chip. Competition from TSMC.
Different from TSMC’s mature FinFET structure, Samsung’s 3nm process will use a new GAA (surround gate) architecture, which will enable it to redesign and transform the core transistor, making the chip area smaller and processing faster. Fast and reduce power consumption.
Samsung Securities analyst Kim Young-soo predicts that the GAA architecture chosen by Samsung is expected to be used by TSMC in the development of the 2nm process in 2024. Technically speaking, Samsung is expected to overtake TSMC in 2023. TSMC will Starting to develop the 2nm process, it is expected that there will be a large number of processors and edge computing chips in the market in the future. The key for Samsung to expand its market share is how many extreme ultraviolet photolithography (EUV) process equipment can be purchased.
However, Rino Choi, a professor in the Department of Materials Science and Engineering at Inha University in South Korea, said that although Samsung is expected to accelerate its surpassing of TSMC by adopting new technologies, if Samsung is unable to rapidly increase production in the initial stage, it may suffer losses.
Market analysts have expressed doubts about whether Samsung can seize the dominant position of TSMC. TSMC spends about 17 billion U.S. dollars a year on research and development of advanced manufacturing processes. Although Samsung‘s semiconductor division plans to spend 26 billion U.S. dollars in capital expenditures in 2020, it is still mainly concentrated in memory business. investment.
Compared with memory, the foundry of processor chips is more complicated, and foundries must always customize solutions for customers, increasing the barriers to entry into the foundry field. This barrier also made Samsung more dependent on customer chips in the past. Design and OEM.
However, Samsung has recently strengthened its foundry solutions, which have also been well received by Nvidia. Samsung executives revealed to Bloomberg that the foundry business has increased by 30% in customers last year, except for the inquiries made by Nvidia and IBM. In addition, Qualcomm also signed a 1 trillion won contract for mobile phone processor chips with Samsung.
Samsung said that it has competitive advantages in chip foundry and related applications (such as Galaxy mobile phones), and 3D wafer packaging ace predicts that these advantages will be able to meet customers‘ foundry requirements. However, some companies may be cautious about outsourcing orders to competitors, and this is a big difference between TSMC and Samsung.
For this reason, CLSA analyst Sanjeev Rana said that the competition between Samsung and TSMC is not only on chip performance, but on who can maintain better power and efficiency under advanced process chips. In addition, although Samsung continues to obtain orders from major customers , But the establishment of long-term relationships between TSMC and customers can provide better coordination of design and manufacturing and output.
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