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Information about Micron‘s 176-layer NAND flash memory and DDR5 chip technology is all here

Time:2021-06-02 Views:40
Recently, Micron Technology has launched new memory and storage products, and said that with the continuous development of the data economy, these products can better serve data-driven enterprises. According to reports, the new flash memory and dynamic random access memory (DRAM) chips are designed to solve the bottleneck of feeding data between memory, storage and processing solutions in modern computers.
Micron Technology said that the new products include its first 176-layer NAND flash memory and 1α DRAM technology, as well as Micron‘s first universal flash memory (UFS) 3.1 solution for automotive applications. These products will serve everything from enterprises to games. Sumit Sadana, Chief Commercial Officer of Micron Technology, said at the press conference that the new product portfolio has realized the company’s vision of accelerating data-driven insights through innovations in memory and storage, so as to realize the transition from the data center to the intelligent edge. new function. He pointed out that the semiconductor industry generally grows faster than the entire world economy, and the demand for memory and flash memory is also growing faster than the semiconductor industry. About 30% of the chip industry is memory and storage.
“It will be used for end devices, whether it is mobile phones and laptops, or data center technology, as well as smart edges such as the Industrial Internet of Things and smart cars,” Sumit Sadana said. "In the next year or two, every part of the market will be turbocharged. These are very exciting trends and herald future development."
Micron also announced at the press conference that the company will deliver its first PCIe Gen4 solid state drive (SSD) in batches, which will be manufactured using what the company calls the world‘s first 176-layer NAND. This month, the company also launched what it calls another world-first LPDDR4x DRAM based on 1α node.
It is reported that Micron‘s LPDDR4x is the latest JEDEC specification for the fourth-generation low-power DRAM, with improved input/output voltage to significantly reduce power consumption, making it an ideal choice for mobile computing devices. Micron said that these latest versions have consolidated the company‘s leading position in DRAM and NAND technology, which the company claims to have established this year. According to market research firm Forward Insights, PCIe Gen4 SSD is expected to grow six times in the next two years. These advancements will help the data economy cope with the explosive growth of data from AI and 5G. As these technologies enter mainstream deployment, they are generating large amounts of data that memory and storage products must keep up with.
For product applications, Micron said that the company‘s latest SSDs, Micron 3400 and 2450, provide high performance and design flexibility with low power consumption, supporting all-day use from professional workstations to ultra-thin notebook computers. The company said that compared with previous generations, Micron 3400 SSD provides twice the read throughput and up to 85% write throughput, supporting real-time 3D rendering, computer-aided design, games and animation and other demanding applications .
For customers looking for low-cost PCIe Gen4 performance, Micron 2450 SSD offers three form factors, as small as 22 x 30mm M.2, to provide great design flexibility. Both Intel and Advanced Micro Devices have verified that the technology can be used in their processors. Jeremy Werner, vice president of Micron Storage, said at a press conference that the PC market now produces 1 million computers per day. IDC, a market research organization, predicts that the PC market will grow by 18% in 2021, following a 13% growth in 2020. Werner said that SSD products are not atomizers because they are shipped today. Micron will ship LPDDR4x in bulk on its leading 1α node this month, following its initial 1α node DRAM products in January 2021. The company also announced that it has completed its 1α-based DDR4 verification AMD EPYC on leading data center platforms (including the third generation). Both are mass-produced in Micron‘s advanced DRAM manufacturing facilities in Taiwan, including its newly established A3 facility in Taichung.
Raj Hazra, Senior Vice President of Computing and Networking of Micron, said at a press conference that Micron 1α-based memory provides advanced technology to drive innovation from data-centric workloads on server platforms to ultra-thin laptops for consumers . The 1-alpha design improves the energy efficiency of the memory, thereby extending the battery life of the laptop in an environment of working at home and studying at home. Micron cooperated with Taiwan OEM Acer to integrate 1α-based LPDDR4x and DDR4 into the Acer system. Hazra said that compared with the previous 1z node LPDDR4x, the 1α node process provides a 40% improvement in memory density and up to 15% energy saving improvement in mobile use cases. He said that this power saving is very suitable for mobile phones that must maintain battery life, especially in memory-intensive use cases such as taking photos and videos.
For data-intensive automotive systems, Micron announced that it is offering 128GB and 256GB density samples for its 96-layer NAND as part of its new UFS 3.1 managed NAND product portfolio for automotive applications. Rugged solutions can be used for in-vehicle entertainment and advanced driver assistance systems (ADAS) at the intelligent edge. ADAS vehicles now have more than 100 million lines of software code, which must be stored and quickly read to obtain a fast user experience. The company stated that the continuous write performance of UFS 3.1 has been improved by 50% to meet the growing real-time local storage requirements of sensor and camera data for Level 3+ ADAS systems and black box applications.
DDR5 is the industry‘s top storage technology in the next few years. Micron said that its DDR5 technical support program has attracted more than 250 design and technology leaders from more than 100 industry leaders, including system and chip supporters and channel partners. , Cloud service providers and OEMs.
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